2017 was an extraordinary year for China. China actively provided solutions, voices and wisdom in international fora and offered better services to users and the public, contributing to the development of inclusive, mutually beneficial, balanced and effective international IP rules and leaving unforgettable IP footprints in 2017.
In January 2017, President Xi Jinping witnessed the signing of a Memorandum of Understanding (MOU) between State Intellectual Property Office of the P.R. China (SIPO) and the Swiss Federal Institute of Intellectual Property.
In March 2017, IP Seminar was held during the Boao Forum for Asia.
In March 2017, Premier Li Keqiang witnessed the signing of IP cooperation agreement between SIPO and IP Australia，as well as SIPO and the Intellectual Property Office of New Zealand.
In May 2017, the IP Five Heads Meeting was held.
In May 2017, China-Visegrad Group Joint Seminar on IP was held.
In May 2017, SIPO, on behalf of the Chinese government, signed with WIPO the Agreement on Enhancing “Belt and Road” IP Cooperation during the Belt and Road Forum for International Cooperation.
In July 2017, China-Africa High level Seminar on IP System and Policies was held.
In August 2017, President Xi Jinping witnessed the signing of MOU between the governments of China and Tajikistan on cooperation in the field of IP.
In September 2017, Cambodia became the first country who recognizes patents granted in China.
In September 2017, the 8th Meeting of China-ASEAN Heads of IP Offices was held.
In September 2017, China-Mongolia-Russia Joint Seminar on IP and the Heads Meeting among SIPO, GAIPSR and Rospatent were held in Russia.
In September 2017, IP cooperation among BRICS countries have been included into BRICS Leaders Xiamen Declaration.
In November 2017, Premier Li Keqiang witnessed the signing of IP agreement between SIPO and the Intellectual Property Office of the Philippines.
In December 2017, the 17th TRIPO (SIPO, JPO, KIPO) Heads meeting was held in Korea.
In December 2017, the 3rd ID5 Annual Meeting was held.
Source: China IP News
